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Ultra clean surfaces
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Room temperature process
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Fast – less than 10 minutes for many applications
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Easy processing
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Modest initial price and minimal operating cost
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Long-term operational reliability
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Direct international shipping
The UV/Ozone cleaning process provides a simple, inexpensive and fast method of obtaining ultra-clean surfaces free of organic contaminants. This process is ideal when thin film deposition with excellent adhesion to the surface is required. Ultra-clean surfaces can easily be achieved by UV/Ozone processing in one to several minutes after the surface has been cleaned by conventional techniques.
Frequently Asked Questions
| What does UV / Ozone cleaning remove? | How clean is “ultra” clean? |
| How does UV / Ozone cleaning work? | What are some applications for UV / Ozone cleaning? |
UV / Ozone cleaning removes traces of:
| Solder flux | Residual photoresist |
| Condensed adhesive volatiles | Carbon traces |
| Human skin oils | Most organic contaminants |
How clean is “ultra” clean?
Contact angle measurements of 4-5 degrees. Miniscule peaks when measured with AES and ESCA. With steam test there are uniform rainbow-like fringes during condensation and evaporation. Often, cleaning of critical surfaces prior to other processing steps is considered finished after the usual scrubbing and ultrasoneration steps. UV/Ozone cleaning adds a valuable new dimension to cleaning that can prove itself in dollars and cents in improved performance and reliability in applications where UV/Ozone can be used after the standard cleaning operation.
How does UV / Ozone cleaning work?
The heart of UVOCS cleaning equipment is a low-pressure quartz mercury vapor lamp, which generates UV emissions in the 254 and 185 nanometer range. Ozone and atomic oxygen are generated. Organic contaminant molecules are excited or dissociated by the absorption of the 254 nm wavelength UV. The excited organic contaminants react with the atomic oxygen to form volatile products such as CO2, H2O, etc. The whole process takes place at essentially room temperature* in one to several minutes.
*The temperature rise of parts is dependent on the length of processing time.
Applications for UV / Ozone cleaning
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Prior to thin film deposition on many surfaces
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CD/DVD masters
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Hybrid Substrates prior to wire bonding – removal of condensed epoxy volatiles
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Improved adhesion to plastic surfaces
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GaAs and InP wafers
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Optical lenses
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Creating Thin Oxide on Silicon wafers
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Silicon Wafers
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OLEDs
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Numerous other uses
Inquire About Other Uses Request a Quote